TCM-BF537

Standard
Order No.: 100-1228-1

The Tiny Core Module TCM-BF537 is optimized for performance and size. The module integrates processor, RAM, flash and power supply at a size of 28 x 28mm! It is based at the high performance ADSP-BF537 from Analog Devices. The Core Module is available for industrial temperature range. It addresses 32 MByte SDRAM via its 16 bit wide SDRAM bus and has an on-board NOR-flash of 8 MByte.

Highlights

ADSP BF537 DSP
32 MByte SD RAM up to 133 Mhz
64 MByte Flash
Very small design (28 x 28 mm)
Ethernet physical on-board
Border Pad
Industrial Core Module (-40 to +85°C)

Typical Applications

Automation and control systems, Mobile Communication, Smart Mobile Devices, Aerospace and Defense, Security and Alarms Systems , Health Care Equipment and Devices, Handheld Medical/Industrial, Test and Measurement , Robotic, Automotive

Package Contents

TCM-BF537 Industrial

Operating system BLACKSheep® OS, uClinux
Bootloader BLACKsheep Boot Loader
CPU
CPU ADSP BF537
Crystal 25 MHz 
General Information
Dimensions 28 x 28 mm
Clock up to 500 MHz 
Temperature Range from -40 to 85 °C 
Weight 4 g 
Memory
Flash 64 MByte 
RAM 32 MByte SD-RAM
Interfaces
Communication 1 x ETH (10/100 MBit, external Physical Chip required), 1 x CAN, 1 x SPI, 1 x PPI (16 bit), 2 x UART, 1 x SPORT, 1 x I²C

Single 3.3V Supply voltage
On-Board core voltage regulator
Low voltage reset circuit
Connector and Ball Grid Array (BGA) versions available

BGA Variant
Connector BGA
Flash 8 MByte 
 
Boarder Pad
Connector Boarder Pad
Flash 8 MByte 
 
Connector Variant
Flash 8 MByte 

Support

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