Modular ToF Kit

The modular ToF Kit is a building block system that was developed to satisfy a variety of demands and applications of depth sensors.

Customer specific ToF solutions can be handled individually. The long standing experience of Bluetechnix in the business of modules facilitates that ToF based depth sensors can be divided into individual components that can be both flexible and compact, and also cost efficient. The modular ToF Kit guarantees maximum flexibility and serves as a basis for customer based ToF solutions.

Modular ToF Kit Contents

Time of Flight Image Sensor Module (TIM)

TIMs are available with different sensor chips (manufacturer and resolution), different aperture angles and different integrated functionality.

Light Module (LIM)

LIMs are available with different number of LEDs, and different aperture angles. LIMs can be combined to LIM arrays to increase the illumination.

Interface Board

Interface boards provide connectors for the modules TIM, LIM and optional processor modules (SoM), and interfaces for the connectivity.

2D Camera (optional)

System on Module - SoM (optional)

The functionality of the ToF depth sensor and the interfaces can be extended with an optional SoM.

Housing (optional)

Choose your MTK housing for a specific MTK interface board.

TIM Interface Overview

TIM Interface Overview

Downloads

TIM_Interface_Overview.pdf pdf (97.1 KB)
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